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TGV Laser Drilling System
Product Description
High-Precision TGV laser drilling solution developed for glass wafer and advanced packaging application.
Laser & Control Technology Overview
1. Ultrafast fs–ps Lasers Programmable spatiotemporal pulse shaping
2. Beam Symmetry > 85% Stable pulse-to-pulse energy
3.PSO Position Control Accuracy at high speed
4.100M-Hole Pattern Files ~10,000 holes/s in line-scan mode
Product specifications
1800*1800*2200
(L*W*H, Indicator light not included)
Key Features
1. Drilling Accuracy ±10 µm
2.High Aspect Ratio Deep & Vertical
3.Ultra-Fast Drilling High Efficiency
4.Stable & Reliable Consistent, repeatable results
5.Smart Control Real-time monitoring & process control
Industries & Applications
1.TGV Advanced Packaging
2.Consumer Electronics
3.PCB & IC Substrates
4.Advanced Displays & Semiconductors
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